| A. ANALYSIS / MEASUREMENT | C. ASSEMBLY / HYBRID MATERIALS | |
| Auger | Bonding Tools | |
| Defect Detection | Bonding Wire | |
| Electrical Test | Chip Carriers | |
| ESCA | Die Attach Compounds | |
| Film Thickness | Headers | |
| Microscopes | Inspection | |
| Probe Stations / Materials | Leadframes:Etched / Stamped | |
| Probing Equipment / Accessories | Leadframes:Raw Materials | |
| SEM | Lids | |
| SIMS | Marking Inks | |
| Software / Manufacturing Management | Molding / Potting Compounds | |
| Surface Inspection / Flatness | Packages - Ceramic | |
| 300mm | Packages - Plastic | |
| X-ray | Preforms / Lids | |
| Scribes / Blades / Saws | ||
| B. ASSEMBLY / HYBRID EQUIPMENT | Sealers / Seal Boats | |
| Automation & Robotics | Shipping Tubes / Trays / Bags | |
| Base Loaders | Software / Manufacturing Management | |
| Burn-In | Substrates | |
| CAM / CIM | TAB | |
| Cleaning Equipment | Thick Film Pastes | |
| Cut & Down Set Machinery | Thin Film Sources | |
| Deflashing | ||
| Device Handling | D. CLEAN ROOM | |
| Dicing Machines | Air Filtering | |
| Die Bonding | Air Flow Controllers | |
| Die Sorter | CAM | |
| Dispensing Systems | Cleaning Chemicals / Wipes | |
| Flip Chip | Cleaning Equipment | |
| Furnaces:IR / Conveyor | Design / Construction | |
| Heating / Annealing | Furniture / Storage | |
| Inspection | Garments | |
| Lead Finishing / Straighteners / Trimmers | Monitoring Systems | |
| Leadframe Taping | Process Stations (Laminar Flow) | |
| Marking Machines / Imprinting | Software / Manufacturing Management | |
| Molding Equipment | Static Control | |
| Ovens:Cure / Heat / Anneal | Storage Units | |
| Pick & Place | Supplies | |
| Printed Circuit Boards | Temperature / Humidity Control | |
| Resistor Trimming | 300mm | |
| Screen Printers | ||
| Sealing | E. CONSULTING | |
| Sockets & Interconnects | Assembly / Hybrid Equipment / Materials | |
| Software / Manufacturing Management | Automation | |
| Soldering & Brazing | CAD / CAM / CIM | |
| Static Control | Clean Room / Contamination Control | |
| TAB Tools | Equipment & Control | |
| Tape & Reel | Flat Panel Display | |
| 300mm | Manufacturing Process | |
| Vision Systems | Process Chemicals / Gases / Materials | |
| Wafer Mount / Tape | Programming | |
| Wire Bonding | Robotics | |
| Safety | ||
| G. FACTORY CONTROL | Software / Manufacturing Management | |
| Automatic Data Collection | Test | |
| CAD | Wafer Fab | |
| CAM / CIM Software / Hardware | Wafer Handling | |
| Communication Protocols | Area Array Packaging Equipment & Materials | |
| Equipment Interface / SECS I & II | ||
| Equipment Usage | F. ELECTRONIC DESIGN AUTOMATION | |
| Logistics / Floor Controls | Hardware | |
| Process Controls | Services | |
| Production Control | Software | |
| Software / Manufacturing Management | Software / Manufacturing Management | |
| Systems Architecture | 300mm | |
| 300mm | ||
| K. PROCESS EQUIPMENT | ||
| H. FLAT PANEL DISPLAY | Automation & Robotics | |
| Assembly Equipment | Bellows | |
| Cleanroom / Handling Storage | CAD | |
| Materials | CVD | |
| Materials Processing | CAM/CIM | |
| Processing Equipment | Cleaning Equipment | |
| Services / Publishing | Cluster Tools | |
| Software / Manufacturing Management | CMP Equipment | |
| Test / Measurement / Repair Equipment | Contamination Control Equipment | |
| Crystal Growing Equipment | ||
| I. PHOTOMASK EQUIPMENT / MATERIALS | Developing | |
| CAD | Diffusion / Oxidation / Annealing | |
| CAM / CIM | Dry Etch Systems | |
| Cleaning Equipment | Epitaxy | |
| Fabrication | Exposure Sources | |
| Mask Making Equipment | Handling / Transfer / Linear Motion Systems | |
| Mask Making Materials | Inspection Equipment | |
| Pellicles / Mounting Equipment | Ion Implantation | |
| Plate Inspection Equipment | Ion Beam Equipment | |
| Plate Repair | Laser Beam Equipment | |
| Software / Manufacturing Management | Lithography | |
| Substrates | Measurement Equipment | |
| 300mm | Ovens | |
| Photoresist Application | ||
| J. PROCESS CHEMICALS | Physical Vapor Deposition | |
| Acids / Etchants | Power Supplies | |
| Chemical Containers | Recirculators | |
| Cleaning Chemicals | Sawing / Lapping / Polishing | |
| Control Handling Equipment | Software / Interfacing | |
| Developers | Software / Manufacturing Management | |
| DI Water | Stripping Systems | |
| Dopants | 300mm | |
| Edge-Bead Remover | Vacuum Pumps / Accessories | |
| Filtering | Vacuum Deposition (Evaporation / Sputtering) | |
| Monitoring Equipment | Wafer Identification | |
| Photoresist | Wet Etch Systems | |
| Piping Systems | ||
| Plating | L. PROCESS GASES / GAS HANDLING EQUIPMENT | |
| Primers | Analytical Standards | |
| Solvents | Argon / Hydrogen / Nitrogen / Oxygen | |
| Spin On Glass | Control / Handling Equipment | |
| Software / Manufacturing Management | Filtering Equipment | |
| Strippers | Gas Control Cabinets | |
| Waste Control | Monitoring Equipment | |
| Piping Systems | ||
| M. PROCESS MATERIALS | Safety Systems | |
| Chemical Resistant Seals | Software / Manufacturing Management | |
| Compound Semiconductors | Specialty Gases | |
| Deposition Materials | Waste Control Systems | |
| Detaping Solvent | Welding | |
| Dopants | ||
| Evaporation | P. WAFER HANDLING / STORAGE | |
| Grind / Lap / Mark / Polish | Cabinets | |
| Ingots | Mini Environments | |
| Polycrystalline Silicon | Process Carriers | |
| Quartzware & Accessories | Software / Manufacturing Management | |
| Sapphire Substrates | 300mm | |
| Software / Manufacturing Management | Transport Containers for Wafer Carriers | |
| Silicon:Single Crystal / Epi | Tweezers / Vacuum Wands | |
| Test & Inspection | ||
| 300mm | Q. ENVIRONMENT, HEALTH & SAFETY | |
| Wafer Dicing Tape | Environment, Health & Safety | |
| Wafers | ||
| R. AREA ARRAY PACKAGING MATERIALS & CONSUMABLES | ||
| N. SERVICES | Adhesives/Epoxies, Conductive & Non-Conductive | |
| Assembly | Bonding/Interconnect Material: Wire, Ribbon, Tape, Lead | |
| Burn In | Chip Carriers: Trays, Reels | |
| Circuit Design | Cleaning Solvents/Solutions | |
| Electrical Test | CSP Burn-In Sockets | |
| Environmental Waste Control | Fine Pitch Lead Frames | |
| Facility | Fine Pitch Probe Cards & other probing fixtures | |
| Ion Implant | High Density Interconnect | |
| Market Studies | Molding/Encapsulation/Coating Materials | |
| Measurement / Inspection | Plating Materials/Chemicals | |
| Parts Cleaning | Solder, Solder Balls & other Soldering Materials | |
| Plating / Electropolishing | Substrates/Laminate Materials | |
| Publications | Thick Dielectric films for Wafer Level Packaging | |
| Safety | Underfill Materials | |
| Sawing / Lapping / Grinding | Wafer Bumping Materials/Supplies | |
| Software / Manufacturing Management | ||
| 300mm | S. AREA ARRAY PACKAGING EQUIPMENT & SERVICES | |
| Training | Acoustic Spectroscopy & other analytical services | |
| Used Equipment | Ball Placement Systems/Equipment | |
| Wafer Analysis | Bonding Equipment: Wire, Ribbon, Tape, Lead, Die | |
| Wafer Processing | CAD/CAM Equipment & Software | |
| Area Array Packaging | Dispensing Systems/Equipment | |
| Chip Scale Manufacturing Robotics/Automation & | ||
| O. TEST | Flip Chip Pick-and-Place Equipment | |
| Automation & Robotics | Inspection Systems/Equipment: | |
| Boards:Burn-In / Performance | Acoustic, Laser, Vision, X-ray | |
| CAD | Lithography Systems for Wafer Level Packaging | |
| CAM / CIM | Package Design Services | |
| Discrete Component Test Systems | Package Handling/Conveying Equipment | |
| Electrical Components | Package Simulation/Characterization Equipment, | |
| Environmental Chambers | Software & Services | |
| Failure Analysis | Packaging/Assembly/Test Subcontractor | |
| Handlers / Positioners | Plating/Bumping Systems & Equipment | |
| Linear Test Systems | Repair/Rework Equipment | |
| LSI / VLSI Test Systems | Screen-printing Equipment | |
| Memory Test Systems | Solder Reflow Ovens/Equipment | |
| Package Test | Wafer Handling/Conveying Equipment | |
| Parametric Test Systems | ||
| Probers | ||
| Programming | ||
| PROM Programmers | ||
| Redundant Memory Repair Systems | ||
| Software / Manufacturing Management | ||
| Test Systems:Wafer Level | ||
| Temperature / Environmental / Pressure | ||
| 300mm | ||
| Vision Systems |